1. Kumu Huahana
Kakau 'ana i ka mānoanoa ultra-mānoanoa, ki'eki'e i ka -plane conductivity thermal a me ka ma'alahi loa, ka 'ike pono, ka māmā a me ka ho'oha'aha'a wela, a me ka ho'olike 'ana i nā pono ho'omohala ki'eki'e -o nā lako uila hou.
2. Nā Kūlana Kūlana Nui
|
ʻĀpana ʻenehana |
Waiwai maʻamau (hiki ke hoʻololi ʻia) |
Kūlana hoʻāʻo |
|
mānoanoa |
0.01–0.10 mm |
ASTM D374 |
|
I ka -plane Thermal Conductivity |
300–1500 W/(m·K) |
ASTM D5470 |
|
ʻO ka mānoanoa |
1.5–2.0 g/cm³ |
ASTM D792 |
|
Kaulana Mahana Hana |
-40 ~ 200 degere |
ISO 18773 |
|
Ikaika U'i |
ʻOi aku a i ʻole like me 15 MPa |
ASTM D882 |
|
Kū'ē Volume |
ʻOi aku a i ʻole like me 1×10¹⁰ Ω·cm |
ASTM D257 |
3. Nā hiʻohiʻona kumu
Māliuli -Ui a maʻalahi: Aia ka mānoanoa mai ka 0.01 mm a i ka 0.10 mm, me ka li'ili'i maika'i a me ka conformability. Hiki ke hoʻopili pono ʻia i nā ʻāpana like ʻole o nā ʻāpana me ka ʻole o ka haki ʻana, e hoʻololi i ka hoʻolālā paʻa o nā mea hana.
Kiʻekiʻe Thermal Conductivity: Ma -e hiki i ka 300–1500 W/(m·K) ka wela wela o ka mokulele, e hoʻoneʻe a hoʻopau koke i ka wela, e hoʻohaʻahaʻa ana i ka wela hana a me ka hoʻolōʻihi ʻana i ke ola lawelawe.
Hana Paʻa: Kū i nā mahana kiʻekiʻe a me nā haʻahaʻa haʻahaʻa (-40 degere a 200 degere ), pale i ka corrosion a me ka ʻelemakule. Paʻa paʻa me ka ʻole o ka deformation a i ʻole ka hoʻohaʻahaʻa ʻana i ka hana ma nā wahi paʻakikī, a hāʻawi i ka insulation uila hilinaʻi e pale aku i nā pōkole pōkole i nā mea kikoʻī.
Māmā & Pili Kaiapuni: He 1.5–2.0 g/cm³ ka mānoanoa, ʻoi aku ka māmā ma mua o nā mea hoʻoheheʻe wela metala kahiko (keleawe, aluminika), me ka hoʻohui ʻole ʻana i ke kaumaha i nā mea hana. ʻAʻohe -ʻawaʻawa, ʻala ʻole a me ka haumia ʻole-ʻole, kūpono loa i nā kūlana palekana kaiapuni.
Hoʻopilikino: Hiki ke hoʻohālikelike ʻia ka mānoanoa, ka nui, ka ʻoki ʻana a me ka conductivity thermal i nā hiʻohiʻona noi a nā mea kūʻai aku a me nā koi ʻenehana.
4. Nā kahua noi
Mea Hoʻohana Electronics: Nā smartphones, papa, laptops, smart wearables (nā wati, earphones), game consoles, hoʻohana ʻia no ka hoʻoheheʻe ʻana i ka wela o nā CPUs, nā pākahi, nā chips a me nā mea nui ʻē aʻe.
Imi Hou: ʻO nā pūke uila mana, nā ʻōnaehana mālama ikehu, nā ʻōnaehana uila uila kaʻa hou, ka hoʻouka ʻana i nā puʻu, hoʻemi maikaʻi i nā mahana o nā modula pākahi a me nā mea mana e hoʻomaikaʻi ai i ka palekana a me ke kūpaʻa.
Lako Hoolaha: Nā kikowaena kumu 5G, modules optical, nā mea alalai, nā transceivers kamaʻilio, e hoʻololi ana i ka mana hana kiʻekiʻe a me ka -wela hana kiʻekiʻe.
ʻImihana & Aerospace: Nā mea hana ho'āʻo lāʻau lapaʻau, nā panela hoʻomalu ʻenehana, nā ʻāpana uila pololei aerospace, nā mea hoʻohuli liʻiliʻi a me ka liʻiliʻi, e hālāwai ana i nā koi hoʻoheheʻe wela kiʻekiʻe no nā mea kiʻekiʻe-hope.
Ua hala kēia mea i ka nānā ʻana i ka maikaʻi. Hāʻawi mākou i nā laʻana manuahi, kākoʻo ʻenehana a me ka -lawelawe hoʻonohonoho hoʻokahi e hoʻokō i nā koi hoʻokele wela o nā mea kūʻai honua. Ua ʻike nui ʻia ʻo ia ma ke ʻano he -ʻoihana kiʻekiʻe ka hoʻokele wela ma ka ʻenehana uila a me nā ʻoihana ikehu hou.
Nā huahana pale: ka pepa graphite ultra -wīwīwīwīwīwīwīwīwīwī, nā mea hana pepa graphite wīwīwīwī waiwela
