1. Hoʻonohonoho ʻana i nā huahana kumu
ʻO -Adhesive Graphite Tape, i hana ʻia me ka -maʻemaʻe kiʻekiʻe ka graphite flake ma ke ʻano he kumu kumu, i hui pū ʻia me ka acrylic/silicone self-papa hoʻopili, a hana ʻia me ka ʻikepili nui-kaʻina hana o ka calendering a me ke kiʻiʻoniʻoni-laminating, ʻo kāna hana koʻikoʻi ʻo ka hāʻawi ʻana i ka "hoʻokō uila, ʻoi aku ka maʻalahi a me ka hikiwawe." mākaukau-e-stick design" solution no nā lako uila/ʻoihana. Hoʻopuka ʻo ia i nā wahi ʻeha o ka hoʻokomo paʻakikī, ka hoʻopili maikaʻi ʻole, a me ka wehe maʻalahi o nā mea graphite kuʻuna, a aia ma waena o ka TOP 4 wikiwiki loa -huahana e ulu ana ma ka mākeke mea uila thermal conductive 2025 (22.3% ka nui o ka ulu makahiki, me ka helu ʻana o nā noi uila mea kūʻai no 58%; Puna ʻIke: Global Materials Industry White Conductive).
2. Nā ʻāpana ʻenehana
|
Nā hōʻailona ʻenehana |
Nā Waiwai Kūlana Nui |
Nā Kūlana hoʻāʻo |
Uku Uku Ui ikepili Nui |
|
mānoanoa |
20-100μm (hiki ke hoʻololi ʻia) |
ASTM D374 |
95% (Ke hoʻololi nei i nā ʻokoʻa o ka wela wela) |
|
Lonitudinal Thermal Conductivity |
ʻOi aku ma mua a i ʻole like me 400 W/(m·K) |
ASTM D5470 |
93% (Koi no ka -kiʻekiʻe ka hoʻoheheʻe wela) |
|
ʻO ka hoʻoili wela wela |
ʻOi aku ma mua a i ʻole like me 150 W/(m·K) |
ASTM D5470 |
91% (Koi no ka hoʻokaʻawale ʻana o ka wela) |
|
ʻO ka ikaika o ka iʻi mua (Acrylic Adhesive) |
ʻOi aku a i ʻole like me 8 N/25mm |
ASTM D3330 |
96% (Nā hiʻohiʻona adhesion maʻamau) |
|
ʻO ka ikaika o ka ʻili mua (Silicon Adhesive) |
ʻOi aku a i ʻole like me 12 N/25mm |
ASTM D3330 |
92% (Nā hiʻohiʻona hoʻopili -mahanahana kiʻekiʻe) |
|
Kū'ē Volume |
ʻOi aku a i ʻole like me 5×10⁻⁴ Ω·cm |
ASTM D257 |
89% (Koi no nā hiʻohiʻona hoʻokele uila) |
|
Palena Palekana |
-40 degere ~150 degere |
IEC 60068-2-11 |
98% (Hoʻololi i nā pae wela ākea) |
|
Ka helu ʻana i ke ahi |
UL94 V0 |
UL 94 |
97% (Koi no ka hoʻokō palekana) |
3. Core hiʻona
Nā Māmā ʻElua o ka -Efficiency Thermal & Electrical Conductivity: No -Adhesive Graphite Tape, e like me ka ikepili mai oi aku 1,200 ho'āʻo pale wela, ua ʻoi aku ka lōʻihi o kona hoʻoili wela ma mua a i ʻole like me 400 W/(m·K) a ʻoi aku ka nui o ka hoʻoili wela ma mua a i ʻole like me 150 W/(m·K). Eia kekahi, ʻoi aku ka liʻiliʻi o kona resistivity i ka 5 × 10⁻⁴ Ω·cm, a ma hope o 500 mau hoʻāʻo ʻana (kulou radius: 5mm), ʻoi aku ka liʻiliʻi o kāna conductivity uila ma mua o 3%, e kūpono ana i nā pono conductivity uila o ka uila uila.
Hoʻopili ikaika a -paʻa lōʻihi: Ma o ka ho'āʻo hoʻopili ʻana ma luna o 800 mau ʻano substrates (metala, plastic, aniani), ʻoi aku ka ikaika o ka peel mua ma mua o a i ʻole like me 8 N/25mm (no ka acrylic adhesive) a ʻoi aku ka nui a i ʻole like me 12 N/25mm (no silicone adhesive). Ma hope o 72 mau hola o ke kiʻekiʻe -mahana (80 degere) ʻelemakule, ʻoi aku ka nui o ka hoʻopaʻa ʻana o ka adhesion ma mua o 90% a i ʻole like me 90%, a ʻaʻohe detachment adhesive i loaʻa i ke ʻano wela o -40 degere ~150 degere, e hōʻemi ana i ka lōʻihi o ka hāʻule ʻana o nā lako i lalo e 75%.
Hiki a hiki i ka hana: Aia ka mānoanoa mai ka 20-100μm (hiki ke hoʻololi ʻia), me ka hiki ke hiki ke pelu ʻia he 180 degere me ka māwae ʻole. Ma o nā hoʻāʻo ʻoki ʻana o CNC, ʻoi aku ka liʻiliʻi o ka lihi ma hope o ka ʻoki ʻana i nā ʻano like ʻole (nā pōʻai, nā lua kūikawā) ma mua o 0.1mm, a ʻo 40% ke kiʻekiʻe o ka hana hana ma mua o nā pepa graphite kuʻuna. He kūpono ia no ka wahi hoʻokomo haiki o nā ʻāpana uila pololei (68% o nā koi i lalo e koi i nā nui maʻamau).
Palekana Kaiapuni & Hoʻokō palekana: Ua hala i ka RoHS 2.0 a me REACH 223-substance hazardous material tests, me ka helu ʻana o ke ahi a hiki i ka UL94 V0. ʻAʻole hoʻokuʻu ʻia ke kinoea ʻawaʻawa i nā wela kiʻekiʻe (150 degere), e hoʻokō ana i nā koi kaiapuni o ka mea kūʻai uila a me nā māla ikehu hou (ʻo kēia hiʻohiʻona ka 92% o nā hoʻoholo kūʻai i lalo).


4. Nā noi kumu
Kahua Uila Mea Hoʻohana(58% proportion, the large application scenario): Hoʻohana ʻia no ka hoʻokuʻu ʻana i ka wela o nā kelepona paʻalima/papa papa (i hoʻopili ʻia ma waena o nā ʻāpana a me nā papa waena) a me nā modula hoʻoheheʻe wela. Wahi a nā ho'āʻo ʻana o ka mea hana terminal, hiki iā ia ke hōʻemi i ka mahana o ka chip ma 12-18 degere, e pale ana i ka throttling hana i hana ʻia e nā wela kiʻekiʻe; He kūpono ia no ka hoʻopili conductive i nā hihia hoʻopiʻi kelepona ʻole, hoʻololi i nā shrapnels metala kahiko a hoʻemi i nā kumukūʻai e 30%.
Kihapai Uila Hou(22% proportion): Hoʻohana ʻia e like me nā gaskets conductive thermal no nā ʻeke pā uila (i hoʻopili ʻia ma waena o nā pūnaewele a me nā pahu), hoʻomaikaʻi ʻo ia i ka maikaʻi conductivity thermal e 45% a hoʻonui i ka like ʻana o ka hāʻawi ʻana i ka mahana o nā ʻeke pākahi i ±2 degere; noi no ka hoopau wela o IGBT modules i ka ikehu waihona inverters, hiki ke ku i ka loihi -mau wela hana o 120 degere a hooloihi aku i ke ola lawelawe a oi 8 makahiki.
Kihapai Lako Hana(15% proportion): Hoʻololi ʻia no nā ʻāpana hoʻoheheʻe wela o nā mea hoʻololi pinepine a me nā kaʻa servo, e hoʻonā i nā pilikia overheating kūloko i ka wā o ka hana ʻana a me ka hoʻohaʻahaʻa ʻana i ka helu hemahema o nā mea hana ʻoihana e 60%; hoʻohana ʻia no nā substrates hoʻoheheʻe wela o nā kukui alanui LED, hoʻomaikaʻi ia i ka maikaʻi o ka wela e 50% a hoʻonui i ke ola lawelawe o nā kumu kukui LED i 50,000 mau hola.
Kahua Uila Hikia(5% proportion): Hoʻohana ʻia no nā kaapuni conductive o nā hōʻike maʻalahi a me nā papa hoʻoheheʻe wela o nā mea hiki ke hoʻohana ʻia (nā kūpeʻe lima / wati).
Nā huahana pale: paʻi kiʻi paʻi kiʻi paʻa ponoʻī
